When
Type
Heat Transfer and Thermal Stress Analyses
This Heat Transfer and Thermal Stress Analysis course investigates the heat transfer problems of thermal expansion and contraction of materials. Fundamentals of heat transfer mechanisms will be provided with plenty of case studies. The phenomena often occur in vessel heat transfer and electronic devices. Three means of heat transfer mechanisms, conduction, convection, and radiation heat transfer will be investigated. Often the equilibrium temperature obtained is of value to a linear static calculation.
OBJECTIVES
Upon completing this course, learners will understand heat transfer mechanisms, analysis, and simulation methods for heat transfer and thermal stress analysis.
LECTURE
- Basic theories of heat transfer mechanism: conduction, convection, and radiation.
- Steady-state and transient heat transfer analysis
- Finite element model construction for heat transfer problem
- Forced convection problem.
- Heat transfer across a surface
- Thermal stress analysis
- Thermal stress analysis modeling
INSTRUCTOR
Prof. Dr. Pramote Dechaumphai and Team
THE COURSE IS DESIGNED FOR
- Product development engineers
- Computer-aided engineers
- Researchers
- Graduate in engineering and related fields
TRAINING STYLE
- Software explanation with demonstration.
- One desktop computer per participant
FEES
15,000 THB (Exclude VAT)
DURATION OF TRAINING
3 Days, 09:00-16:00
VENUE
UNDO Center, Sinn Sathorn Tower 23rd Floor, Krungthonburi Road, Klongsan, Bangkok (BTS Krungthonburi)