0-2862-1188
When
20,000 Baht per person (Exclude VAT)
Heat Transfer and Thermal Stress Analyses
This Heat Transfer and Thermal Stress Analysis course investigates the heat transfer problems of thermal expansion and contraction of materials. Fundamentals of heat transfer mechanisms will be provided with plenty of case studies. The phenomena often occur in vessel heat transfer and electronic devices. Three means of heat transfer mechanisms, conduction, convection, and radiation heat transfer will be investigated. Often the equilibrium temperature obtained is of value to a linear static calculation.
OBJECTIVES
Upon completing this course, learners will understand heat transfer mechanisms, analysis, and simulation methods for heat transfer and thermal stress analysis.
LECTURE
- Review of Heat Transfer Fundamentals
- Steady-State Formulation
- Transient Formations
- Steady-State Thermal Analysis
- Conduction and Convection Heat Transfer
- Transient Thermal Analysis
- Radiation Heat Transfer Analysis
- Thermal Stress Analysis
WORKSHOPS
- PCB with Heat Flux and Constant Temperature at Boundary
- Steady-state Analysis with Free Convection and Internal Heat
- Typical Avionics Flow with Coupled Advection
- Transient Analysis of Heating of an Ice-Cream Block
- Transient Response of Power Electronics
- Single Radiation Enclosure with Five Faces
- PCB Thermal Contact
- Turbine Blade Thermal And Structural Analysis.
- Integrated Circuit Board Thermal Stress Analysis
THEORY SECTION by Prof. Dr. Pramote Dechaumphai
PRACTICAL SECTION by CAE team
THE COURSE IS DESIGNED FOR
- Product development engineers
- Computer-aided engineers
- Researchers
- Graduate in engineering and related fields
TRAINING STYLE
- Software explanation with demonstration.
- One desktop computer per participant
FEES
20,000 THB (Exclude VAT)
DURATION OF TRAINING
4 Days, 09:00-16:00
TRAINING DATE:
24, 25 Jun, 1, 2 Jul 2025
VENUE
UNDO Center, Sinn Sathorn Tower 23rd Floor, Krungthonburi Road, Klongsan, Bangkok (BTS Krungthonburi)
